Diemat's thermal adhesives are a family of Ag loaded
organic adhesives with unmatched thermal
conductivities up to 60W/mK, exceeding most
common solders. Plating, flux, and atmosphere
requirements of solder attach are eliminated when used
to replace solder. Lower processing temperatures also
allow the use of lower cost plastic packages. The
DM4030, DM5030, and DM6030 series range in polymer
chemistry from thermoplastic to thermoset with interpenetrating networks of both polymers, offering
application-specific solutions to a variety of thermal
and stress management problems.